Could you please help me revise it I completed a two-year internship at OOO Laboratory, which primarily works in developing the technology of Flip Chip and 3-Dimensional Packaging. During my internship in Professor XXX’s group, I studied the reliability of solder joints technology and I researched the interfacial reaction of In/Cu, In/Ni, and In-Sn/Cu. By observing the morphology and analyzing the microstructure, I tried to figure out the formation mechanisms of the intermetallic compounds under different heat treatment processes. During the experimental procedures, I gained the ability in operating different kinds of apparatus and using scientific theories and explanations to develop hypotheses; most important of all, I got an opportunity to apply the knowledge I had learned in the classes to real research experiences, and I also had a chance to explore if this field is right for me.